“Our technical substrates are the foundation for the manufacture of high-performance, reliable semiconductor elements that the electronics industry needs,” said Dr. Bernard Aspar, COO of Soitec. “With our production sites, both in France and Singapore, we have created the world`s largest capacity with the most advanced technical substrates to meet the requirements of this fast-growing 5G market. We are very pleased to continue our partnership with GLOBALFOUNDRIES through this multi-year agreement. GlobalFoundries (GF) of Santa Clara, CA, USA (one of the world`s largest semiconductor foundries with subsidiaries in Singapore, Germany and the United States) and Bernin`s Soitec technical substrate manufacturers near Grenoble, France, have announced a multi-year supply agreement for 300mm high-frequency silicon wafers (RF-SOI). Building on the long-standing partnership between the two companies, the strategic agreement ensures the supply of wafers that will enable it to strengthen its role in providing solutions for the next generation market. With the leadership of these two companies, FD-SOI has become a standard technology for low-cost, energy-efficient devices in consumer, IoT and automotive applications. The agreement, which takes effect immediately, builds on the close ties between the companies and guarantees the supply of wafers for GF`s 22FDX technology platform (22FDX®). “GLOBALFOUNDRIES provides industry-leading FD-SOI solutions, with extremely low power consumption and on-demand performance, with cost-sensitive manufacturing options,” said John Docherty, senior vice president of global operations at GF. “With Soitec as a long-term strategic partner, this agreement ensures a secure supply to meet the high-level capacity needs of current and future customers.” The new agreement builds on the strong partnership between GF and Soitec. In 2017, the two companies entered into a five-year supply contract for fully exhausted silicon-on-isolator (FD-SOI) wafers for GF`s 22FDX® platform. GF`s 22FDX platform, manufactured in Dresden, Germany, has since achieved $4.5 billion in design gains with more than 350 million chips delivered to customers around the world.
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